The project contains theoretical research of electrotechnical manufacture for lead-free reflow soldering. It contains characterization of soldering processes. Includes variations of solder paste printing, principles of part placing and also reflow soldering process. The project appoints possibilities of testing solder joints strength, mainly focused on mechanical vibrations. It describes a design and preparation of solder joint strength test methods by mechanical vibrations. It compares influence of vibrations on part types and solder alloys.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219777 |
| Date | January 2012 |
| Creators | Drab, Tomáš |
| Contributors | Šandera, Josef, Szendiuch, Ivan |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Slovak |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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