Return to search

Studium spolehlivosti bezolovnatých pájených spojů / Study of lead-free solder joints reliability

The thesis deals with problems concerning lead free soldering especially the study of the structure of solder joints and their reliability. The thesis evaluates lead free solder alloys. The theoretical part includes basic principles of soldering and methods of investigating solder joints reliability. The experimental part deals with the impact of water cooling and vibration on solder joint structure. Both methods are tested and are evaluated with regard to their reliability. The used tests include X-ray inspection, optical inspection, mechanical tests, investigating joint structure with electrone microscope.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:218809
Date January 2010
CreatorsPícha, Jan
ContributorsStarý, Jiří, Szendiuch, Ivan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0021 seconds