Return to search

Studená chemická laminace keramiky s nízkou teplotou výpalu / Cold Chemical Lamination of Low Temperatue Co-fired Ceramics

This paper deals with production of the structures fabricated using low temperature co-fired ceramics. Focus is on the lamination of raw ceramic tapes. There are presented classical thermo-compressive methods and a new method using chemical solutions for tape bonding. Describes new lamination technology and their advantages are the absence of elevated temperatures and high pressures. This method reduces using of higher temperatures and high pressure during lamination. On the other hand, chemical process of tape bonding is not flawless. There are many problems including solvent deposition, extreme sensitivity to dust and other processing parameters. It also describes the fabrication of structures by chemical way. Specifically, analyzes the method Cold Chemical Lamination and provides examples of possible deposition solvents which are needed for etching the surface of the LTCC tape during the lamination.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:221030
Date January 2014
CreatorsJurásek, Matěj
ContributorsSomer, Jakub, Štekovič, Michal
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0016 seconds