The paradigm change in automotive power electronics towards wide bandgap semiconductor devices poses new challenges and requirements for the die-related packaging technologies as well as the assessment of reliability and lifetime. Here, the use of sintered silver for the die-related packaging in particular has proven promising. However, the empirical lifetime models for power modules developed over many years are not suitable any more. A holistic Physics-of-Failure approach can provide remedy as it allows for a significant reduction of testing time via finite element simulations. This approach requires a detailed understanding of the relevant failure mechanisms as well as an electrical, thermal and mechanical characterisation of the involved materials. A failure analysis of the complete power module revealed that the top-side sinter layer connecting the copper foil to the semiconductor die is prone to degradation. Therefore, the core of this work is the mechanical characterisation of porous sintered silver and, in particular, the primary and secondary creep behaviour. A newly developed creep model which - for the first time - takes load reversal for primary creep into account is implemented with a subroutine. This allows for lifetime simulations within a Physics-of-Failure framework resulting in a first lifetime model on module level for a complex automotive power module employing sintered silver.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:92517 |
| Date | 26 July 2024 |
| Creators | Forndran, Freerik |
| Contributors | Wunderle, Bernhard, Schneider-Ramelow, Martin, Technische Universität Chemnitz |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | info:eu-repo/semantics/acceptedVersion, doc-type:doctoralThesis, info:eu-repo/semantics/doctoralThesis, doc-type:Text |
| Rights | info:eu-repo/semantics/openAccess |
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