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Thermo-mechanical reliability of flip-chip assemblies with heat spreaders
Description
Techn. University, Diss., 2003--Berlin.
Links & Downloads
http://edocs.tu-berlin.de/diss/2003/wunderle_bernhard.pdf
http://edocs.tu-berlin.de/diss/2003/wunderle_bernhard.htm
http://deposit.d-nb.de/cgi-bin/dokserv?idn=968327206
Tags
Additional Fields
Identifer
oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/175160919
Creators
Wunderle, Bernhard.
Source Sets
OCLC
Language
English
Detected Language
English
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