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Evaluation of secondary wire bond integrity on silver plated and nickel/palladium based lead frame plating finishes

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/427649771
Date January 2008
CreatorsSrinivasan, Guruprasad.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeElectronic books. Electronic dissertations.
SourceOnline access via UMI:

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