Hybrid spectral/intelligent modeling, control and diagnosis for nonlinear distributed curing processes /

Description

Thesis (Ph. D.)--City University of Hong Kong, 2005. / "Submitted to Department of Manufacturing Engineering and Engineering Management in partial fulfillment of the requirements for the degree of Doctor of Philosophy." Includes bibliographical references (leaves 169-181).

Links & Downloads

1. http://libweb.cityu.edu.hk/cgi-bin/ezdb/thesis-r.pl?phd-meem-b19887334f.pdf
2. http://libweb.cityu.edu.hk/cgi-bin/ezdb/thesis.pl?phd-meem-b19887334a.pdf

Tags

Microelectronic packaging.

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/64263383
Date	January 2005
Creators	Deng, Hua.
Source Sets	OCLC
Language	English
Detected Language	English
Source	access full-text access abstract and table of contents