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Investigation of bulk solder and intermetallic failures in PB free BGA by joint level testing

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department or Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/433010908
Date January 2009
CreatorsTumne, Pushkraj Satish.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeElectronic books. Electronic dissertations.
SourceOnline access via UMI:

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