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Finite element analysis of three-dimensional corner stress singularities and its application in microelectronics packaging /

Thesis (Ph. D.)--Lehigh University, 2002. / Includes bibliographica references and vita.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/51056591
Date January 2002
CreatorsXu, Anqing,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeAcademic dissertations

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