Design and fabrication of a flip-chip-on-chip multi-chip module with 3D packaging structure and through-silicon-via for underfill dispensing /

Description

Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004. / Includes bibliographical references (leaves 116-127). Also available in electronic version. Access restricted to campus users.

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1. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20TSUI

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/55116002
Date	January 2004
Creators	Tsui, Yat Kit.
Source Sets	OCLC
Language	English
Detected Language	English
Source	View abstract or full-text.