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Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems

Thesis (Ph.D)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Meindl, James D.; Committee Member: Bakir, Muhannad S.; Committee Member: Davis, Jeffrey A.; Committee Member: Gaylord, Thomas K.; Committee Member: Kohl, Paul A.; Committee Member: Naeemi, Azad. Part of the SMARTech Electronic Thesis and Dissertation Collection.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/430192799
Date January 2008
CreatorsHuang, Gang.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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