Return to search

Interconnect technology for three-dimensional chip integration

Ulm, Univ., Diss., 2007.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/315787079
Date January 2007
CreatorsMunding, Andreas,
Publisher[S.l. : s.n.],
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeOnline-Publikation.
SourceKostenfrei

Page generated in 0.0017 seconds