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CUSTOMIZABLE MULTICHIP MODULES FOR HIGH-G TELEMETRY APPLICATIONS

International Telemetering Conference Proceedings / October 25-28, 1999 / Riviera Hotel and Convention Center, Las Vegas, Nevada / The Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.

Identiferoai:union.ndltd.org:arizona.edu/oai:arizona.openrepository.com:10150/608736
Date10 1900
CreatorsMuller, Peter, Burke, Larry, Sommerfeldt, Scott, Lunceford, Brent, Francomacaro, Shaun, Lehtonen, S. John
ContributorsArmy Research Laboratory, Microelectronics and Computer Technology Corporation, Johns Hopkins University
PublisherInternational Foundation for Telemetering
Source SetsUniversity of Arizona
Languageen_US
Detected LanguageEnglish
Typetext, Proceedings
RightsCopyright © International Foundation for Telemetering
Relationhttp://www.telemetry.org/

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