Carbon/molecule/Cu/Au molecular junctions were fabricated on 4-inch silicon wafers using microfabrication techniques common in commercial semiconductor manufacturing. Electron-beam deposited carbon films are introduced as substrates, and the junctions exhibited high yield and excellent reproducibility. Current density-voltage characteristics of the devices were area scaling, weakly dependent on temperature and exponentially on molecular film
thickness, and quantitatively similar to those of devices made with other techniques reported previously in our group, which contained pyrolyzed photoresist films as substrates. Furthermore, the test of cycle life and thermal
stability reveals that the devices can survive at least under several millions of potential cycles at room temperature in air, and elevated temperature up to 150
C in vacuum for >40 hours. Parallel fabrication, thermal stability, and high yield are required for practical applications of molecular electronics, and the reported results provide important steps toward integration of molecular electronic devices with commercial processes and devices.
| Identifer | oai:union.ndltd.org:LACETR/oai:collectionscanada.gc.ca:AEU.10048/1657 |
| Date | 06 1900 |
| Creators | Ru, Jie |
| Contributors | McCreery, Richard L. (Chemistry), McDermott, Mark T. (Chemistry), Evoy, Stephane (Electrical and Computer Engineering) |
| Source Sets | Library and Archives Canada ETDs Repository / Centre d'archives des thèses électroniques de Bibliothèque et Archives Canada |
| Language | English |
| Detected Language | English |
| Type | Thesis |
| Format | 2850666 bytes, application/pdf |
| Relation | Jie Ru, Bryan Szeto, Andrew Bonifas, and Richard L. McCreery. ACS Appl. Mater. Interfaces, 2010, ASAP. http://pubs.acs.org/doi/abs/10.1021/am100833e |
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