This diploma thesis is focused on the influence of thermal modification on the strength of bonded joint in tension according to ČSN EN 205. For the purpose of this work was used beech wood. The thermal modification of the test samples was performed at temperatures of 160 °C, 180 °C and 200 °C. The selected bond strength adhesives were melamine-urea formaldehyde adhesives (MUF), phenol-resorcinol formaldehyde adhesives (PRF) and one-component polyurethane adhesives (PUR). In addition to the thermal modification the effect of plasma modification on bond strength is also determined. The test lamellas were plasma treated (DCSBD) prior to gluing and pressing. The result is the determination of the tensile strength of the bonded joint in all the above-mentioned modifications and comparation of the results.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:428635 |
| Date | January 2019 |
| Creators | Šmíd, Pavel |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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