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Experimental study of void formation in solder joints of flip-chip assemblies

Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Ronald L. Panton. Vita. Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/62110547
Date January 2005
CreatorsWang, Daijiao, Panton, Ronald L.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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