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Non-invasive thermal profiling of silicon wafer surface during RTP using acoustic and signal processing techniques /

Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 104-108). Available also in a digital version from Dissertation Abstracts.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/49497960
Date January 2000
CreatorsSyed, Ahmed Rashid,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceDigital version accessible at:

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