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Studie srovnání vlastností pouzder QFN a BGA / Study of BGA and QFN package properties

This work deals with the issue of packaging and heat transfer. Especially this work focused on QFN and BGA packages. Nowadays most sophisticated conventional solution. First part deals with analysis of the current status of packages. Next part is analyze the issue of heat transfer in electronic systems. The following section is an experimental dealing with simulation in ANSYS Workbench and validation of these simulations by designed test structures. At the end is evaluated properties and behavior of these packages.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:221108
Date January 2015
CreatorsSkácel, Josef
ContributorsPsota, Boleslav, Szendiuch, Ivan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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