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Analýza defektů na DPS za použití moderních optických metod / Analysis of Defects on PCB Using Modern Optical Method

This diploma thesis is focused on detecting of defects on BGA (Ball Grid Array) components using of X-ray. Defects are formed during reflow BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection or micro sections. There is disclosed a device NORDSON DAGE XD7600NT its operation and setup. The device enables advanced methods of scanning called X-plane. For creating 3D models used reconstructive software called CERA, which uses raw data from the method of X-Plane.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:254482
Date January 2016
CreatorsVala, Martin
ContributorsŘezníček, Michal, Řihák, Pavel
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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