The thesis deals issue of the solder joint reliability and diagnostics. The manufacturing technology of electronics currently features a very high level of perfection. A large number of electrical devices ends its functional life due to solder joint failure. The objective of presented research consists studies of processes taking place in the solder joint due to soldering and after soldering. To this end, I will employ several methods of diagnostics. Noise based methods of solder joint measurement was evaluated. Based on a detailed study and understanding of processes it can be solder joint reliability predicted.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:233692 |
| Date | January 2015 |
| Creators | Stejskal, Petr |
| Contributors | Skočil, Vlastimil, Hovorka, Ladislav, Kazelle, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/doctoralThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
Page generated in 0.0018 seconds