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A theoretical framework for the dynamic analysis of a printed wiring board under mechanical and thermal loading

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Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/16615
Date12 1900
CreatorsHe, Xiaoling
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeDissertation
RightsAccess restricted to authorized Georgia Tech users only.

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