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Výzkum spolehlivosti pájených spojů v dusíkové atmosféře / Investigation of Reliability for Solder Joints in Nitrogen Atmosphere

This thesis examines the inuence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature proles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the inuence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:221102
Date January 2015
CreatorsŠefara, Petr
ContributorsOtáhal, Alexandr, Szendiuch, Ivan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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