Since most of the energy input is converted to thermal energy in laser applications,
the proper thermal management of laser systems is an important issue. Maintaining
the laser diode and crystal temperature distributions in a narrow range during the
operation is the most crucial requirement for the cooling of a laser system.
In the present study, thermoelectric cooling (TEC) of a 1064 nm wavelength diode
pumped laser source is investigated both experimentally and numerically.
During the heat removal process, the thermal resistance through and between the
materials, the proper integration of the TEC assembly, and the heat sink efficiency
become important. For the aim of evaluating and further improving the system
performance, various assembly configurations, highly conductive components,
efficient interface materials and heat sink alternatives are considered.
Several experiments are conducted during the system development stage, and parallel
numerical simulations are performed both for comparison and also for providing
valuable input for the system design. Results of the experiments and the simulations
agree well with each other.
As the laser device works in the transient regime, the experiments and the
simulations are also implemented in this regime.
In the final part of the study, the experiments are performed under the actual device
working conditions. It is proved that with the designed TEC module and the copper
heat sink system, the laser device can operate longer than the required operational
time successfully.
| Identifer | oai:union.ndltd.org:METU/oai:etd.lib.metu.edu.tr:http://etd.lib.metu.edu.tr/upload/12612550/index.pdf |
| Date | 01 December 2010 |
| Creators | Yuksel, Yuksel |
| Contributors | Okutucu, Tuba |
| Publisher | METU |
| Source Sets | Middle East Technical Univ. |
| Language | English |
| Detected Language | English |
| Type | M.S. Thesis |
| Format | text/pdf |
| Rights | To liberate the content for public access |
Page generated in 0.0017 seconds