The effect of residual stress on the post-weld-shift (PWS) of a fiber-solder-ferrule (FSF) under a cyclic thermal load is investigated in this thesis. By using the finite element software MENTAT and MARC, the stress distribution in this model of coupled thermal-elastoplasticity is adopted to solve. The temperature dependent material properties are employed to calculate the residual stresses and the thermal stresses of the solder in the solidification process. The PWS of a fiber and the stress distribution of a solder under different temperature cycles are also investigated in this study. The PWS calculated with and without considering residual stresses are compared with the measured data in this study. Results indicated that the effects of residual stresses introduced in the solder solidification can not be ignored. The temperature dependent material properties, i.e., the melting temperature , Young¡¦s Modulus, coefficient of thermal expansion (CTE) and yield strength at high temperature may affect the residual stress distribution and the PWS of the FSF significantly.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0712100-113745 |
| Date | 12 July 2000 |
| Creators | Chen, Po-Chuan |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0712100-113745 |
| Rights | unrestricted, Copyright information available at source archive |
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