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Příprava vodivých struktur bezproudovým pokovením vytištěného prekurzoru / Fabrication of conducting patterns by material electroless plating of printed precursor

The subject of this diploma thesis is the preparation of conductive structures by electroless plating of an extruded precursor. The experimental part deals with the preparation of standard patterns based on the length of immersion time in a coppering bath. The precursor layers were applied with Fujifilm Dimatix to various receiver substrates. The individual substrates with the precursor layer were immersed in the copper solution within different time intervals. The structure of the layers of grown copper and their thickness was characterized by a profilometer.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:449338
Date January 2021
CreatorsKováčová, Silvia
ContributorsGemeiner,, Pavol, Dzik, Petr
PublisherVysoké učení technické v Brně. Fakulta chemická
Source SetsCzech ETDs
LanguageSlovak
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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