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Characterization of 3D Silicon Pixel Detectors for the ATLAS ITk

After ten years of massive success, the Large Hadron Collider (LHC) at CERN
is going for an upgrade to the next phase, The High Luminosity Large Hadron
Collider (HL-LHC) which is planned to start its operation in 2029. This is expected to
have a fine boost to its performance, with an instantaneous luminosity of 5.0×1034
cm-2s
-1
(ultimate value 7.5×1034 cm-2s
-1
) with 200 average interactions per bunch
crossing which will increase the fluences up to more than 1016 neq/ cm2
, resulting in
high radiation damage in ATLAS detector. To withstand this situation, it was
proposed to make the innermost layer with 3D silicon sensors, which will have
radiation tolerance up to 2×1016 neq/cm2 with a Total Ionization Dose of 9.9 MGy.
Two-pixel geometries have been selected for 3D sensors, 50 × 50 μm2
for Endcap
(ring), which will be produced by FBK (Italy) and SINTEF (Norway), and 25 × 100
μm2
for Barrel (stave), will be produced by CNM (Spain). A discussion is made in
this thesis about the production of FBK on both geometries, as they have made a
breakthrough with their Stepper lithography process. The yield improved, specifically
for the geometry 25 × 100 μm2 with two electrode readouts, which was problematic
in the mask aligner approach. Their sensors were characterized electrically at waferlevel as well as after integration with RD53a readout chip (RoC) on single-chip cards
(SCC) and were verified against Innermost Tracker criteria. The SCCs were sent for
irradiation up to 1×1016 neq/cm2 and were tested under electron test beam, and a hit
efficiency of 97% was presented. Some more SCCs have been sent to Los Alamos
for irradiating them up to 1.5×1016 neq/cm2 fluence. As the 3D sensors will be
mounted as Triplets, a discussion is also made on their assembly and QA/QC
process. A reception testing and electrical testing setup both at room temperature
and the cold temperature was made and discussed, with results from some early
RD53a RoC-based triplets. The pre-production sensors are already evaluated, and
soon they will be available bump-bonded with ITkPixV1 RoC for further testing.

Identiferoai:union.ndltd.org:unitn.it/oai:iris.unitn.it:11572/347623
Date30 June 2022
CreatorsSamy, Md. Arif Abdulla
ContributorsSamy, Md. Arif Abdulla, Dalla Betta, Gian Franco, Pancheri, Lucio
PublisherUniversità degli studi di Trento, place:TRENTO
Source SetsUniversità di Trento
LanguageEnglish
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/doctoralThesis
Rightsinfo:eu-repo/semantics/openAccess
Relationfirstpage:1, lastpage:227, numberofpages:227

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