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Packaging of silicon carbide high temperature, high power devices processes and materials /

Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.111-116).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/244251688
Date January 2006
CreatorsLiu, Yi, Johnson, R. Wayne,
PublisherAuburn, Ala. ,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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