Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. In response to this shift, finding multifunctional materials with excellent thermal conductivity and tailored electrical properties are becoming increasingly important. For this research thesis, three different studies were conducted to develop and characterize thermally conductive polymer composites. In the first study, a PPS matrix was combined with different types of carbon-based fillers to determine the effects of filler’s size, shape, and orientation on thermal conductivity. In the second study, effects of adding ceramic- and carbon- based fillers on the tailored thermal and electrical properties of composites were investigated. Lastly, the possibility of improving the thermal conductivity by introducing and aligning polymer fibers in the composites was investigated. The composites were characterized with respect to their physical, thermal, and electrical properties to propose possibilities of application in the electronic packaging industries.
| Identifer | oai:union.ndltd.org:TORONTO/oai:tspace.library.utoronto.ca:1807/32473 |
| Date | 20 July 2012 |
| Creators | Khan, Muhammad Omer |
| Contributors | Naguib, Hani E., Dawson, Francis P. |
| Source Sets | University of Toronto |
| Language | en_ca |
| Detected Language | English |
| Type | Thesis |
Page generated in 0.0023 seconds