Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:217906 |
| Date | January 2009 |
| Creators | Buřival, Tomáš |
| Contributors | Špinka, Jiří, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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