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Lead-free wave soldering of "thick" PCB using Sn 3.8% Ag 0.07% Cu and no-clean voc-free flux

Thesis (M.S.)--State University of New York at Binghamton, Industrial and Systems Engineering Dept., 2007. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/304436091
Date January 2007
CreatorsMukherjee, Shantanu.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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