Investigation of bulk solder and intermetallic failures in PB free BGA by joint level testing

Description

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department or Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.

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1. http://proxy.binghamton.edu/login?url= http://wwwlib.umi.com/dissertations/fullcit/1465178

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/433010908
Date	January 2009
Creators	Tumne, Pushkraj Satish.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Electronic books. Electronic dissertations.
Source	Online access via UMI: