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Experimental and numerical study of solder ball joints' reliability at package level & board level /

Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/381035335
Date January 2009
CreatorsXu, Zhengjian.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceView abstract or full-text.

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