The doctoral thesis is focused on reliability of lead-free solder SAC 305. Knowledge in the field of fatigue models used in determining the lifetime of solder joints are observed in this thesis. Also such methods of predicting reliability as numerically-analytical methods or reliability experimental tests are mentioned. Practical results of reliability measurement are presented. Experimental data served as the foundation for determining empirical coefficients for the fatigue model based on deformation induced by creep of the solder, which was implemented in the ANSYS environment. Results from different methods were compared and conclusions discussing the suitability of the presented prediction methods are formulated.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:233569 |
| Date | January 2012 |
| Creators | Švecová, Olga |
| Contributors | Kolařík, Vladimír, Urbánek,, Jan, Šandera, Josef |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/doctoralThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
Page generated in 0.0016 seconds