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SnBi pájecí pasta a vliv reaktivních nanočástic / SnBi Solder Paste and Influence of Reactive Nanoparticles

This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:377337
Date January 2018
CreatorsRychlý, Ivo
ContributorsŠpinka, Jiří, Starý, Jiří
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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