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Trendy v oblasti pájecích past a vliv nanočástic / Trends in Solder Paste Area and Nanoparticles Influence

This thesis deals with novel trends in solder paste technology. It focuses on nanoparticle applications used as a tool for improving a state of the art lead free solder alloys. The recently published results about the impact of different types of nanoparticles on properties of newly-emerged nanocomposite solders are discussed and summarized in the thesis. Preparation, practical application and testing of new solder paste based on low temperature SnBi alloy with an admixture of titanium dioxide are also discussed. Finally, properties of solder joints using these solder pastes are investigated and the results are evaluated.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:242070
Date January 2016
CreatorsDosedla, Milan
ContributorsŠpinka, Jiří, Starý, Jiří
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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