Optical communication dominates the wire-communication since the requirement of the high speed data transfer in the Internet. Fiber Solder Ferrule (FSF) plays an important role in transceiver modules of the optical communication. For the reason to keep the coupling efficiency between the laser diode and fiber after time using and a various temperature operation, fiber has to be carefully fixed in the metal ferrule. The fixing of the fiber now is finished to let the melting solder flow into a 400£gm diameter ferrule by the capillary action manually. The stability and accuracy of this method can not match the required performance. And the human operation makes this process more unstable to cut down the yield below 30% even by an experienced operator. So, this study analyzes the FSF process and proposes an active strategy to replace the original passive method by capillary action. An active soldering mechanism is implemented to precisely and stable filling the solder into the ferrule. The yield can be significantly raised from 25% to 75%.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0930103-155910 |
| Date | 30 September 2003 |
| Creators | Chen, Mu-Yueh |
| Contributors | Ying-Chien Tsai, Jao-Hwa Kuang, Yi-Jen Chiu, Yih-Tun Tseng, Wood-Hi Cheng |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0930103-155910 |
| Rights | unrestricted, Copyright information available at source archive |
Page generated in 0.0018 seconds