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Vliv smáčecích charakteristik na spolehlivost pájeného spoje / Solder Joint Reliability and Wetting Characteristics Influence

This thesis deals with the methodology of testing the wetting characteristics for different material and process effects in the double-plated base material. Testing is performed by wetting balance method. There is designed procedure to calculate the angles on each side of the non-homogeneous material. The Design of Experiments method is used to interpret the results, by using this method are also interpreted electrical and mechanical properties of solder joints. The correlation with wetting characteristics is discussed.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:218775
Date January 2010
CreatorsLabaj, Radek
ContributorsStejskal, Petr, Starý, Jiří
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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