This work is considered about changes of electric conductivity in lead-free soldered joint's affected by current and thermal stress. The theoretical part describes factors influencing the solder joint electric conductivity and solder joint reliability. The basis of the practical part is the design of the testing method of the soldered joint's electric conductivity. The aim of this part is to measure and observe changes of solder joint electric conductivity after current and thermal stress in various material a procedural combinations.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:218671 |
| Date | January 2010 |
| Creators | Lačný, Radek |
| Contributors | Stejskal, Petr, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
Page generated in 0.0016 seconds