Return to search

Mechanické testování pájených spojů / Machanical testing of solder joints

The project contains theoretical research of electrotechnical manufacture for lead-free reflow soldering. It contains characterization of soldering processes. Includes variations of solder paste printing, principles of part placing and also reflow soldering process. The project appoints possibilities of testing solder joints strength, mainly focused on mechanical vibrations. It describes a design and preparation of solder joint strength test methods by mechanical vibrations. It compares influence of vibrations on part types and solder alloys.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219777
Date January 2012
CreatorsDrab, Tomáš
ContributorsŠandera, Josef, Szendiuch, Ivan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageSlovak
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0019 seconds