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Quality inspection and reliability study of solder bumps in packaged electronic devices [electronic resource] : using laser ultrasound and finite element methods

Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Ume, I. Charles; Committee Member: Danyluk, Steven; Committee Member: Goyal, Deepak; Committee Member: Lu, Jye-Chyi(JC); Committee Member: Michaels, Thomas; Committee Member: Sitaraman, Suresh. Part of the SMARTech Electronic Thesis and Dissertation Collection.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/430524817
Date January 2008
CreatorsYang, Jin.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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