The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:254471 |
| Date | January 2016 |
| Creators | Roháček, Peter |
| Contributors | Špinka, Jiří, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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