Dependence of stress and resistivity of sputtered copper films on deposition conditions /

Description

Thesis (M.S.)--Rochester Institute of Technology, 1989. / Includes bibliographical references (leaves 74-76).

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1. http://hdl.handle.net/1850/10686

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/20142294
Date	January 1989
Creators	Chen, Tse-Shih.
Source Sets	OCLC
Language	English
Detected Language	English
Source	Online version of thesis