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A Study of The Mixed-Mode Fracture of Molding Compound-Substrate Interface of IC Package

Abstract
The interface crack of an IC package is easily existed under vibration, high temperature or collision. Its reliability will be reduced significantly for the existence of the crack. This study, therefore, is to investigate the fracture mechanism of the underfill/substrate interface with different crack length.
In this study, mixed mode fracture of the underfill/substrate interface, was investigated by single lap tension test. Based on the load-displacement curve, J integral, energy release rate and stress intensity factor were calculated. Moreover, the relationships among the stress intensity facto KI, KII and phase angle were also derived.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0822103-145648
Date22 August 2003
CreatorsHuang, Ming-Yeong
Contributorsnone, none, none
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0822103-145648
Rightswithheld, Copyright information available at source archive

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