Effects of sputter deposition parameters on stress in tantalum films with applications to chemical mechanical planarization of copper /

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Thesis (M.S.)--Rochester Institute of Technology, 2004. / Typescript. Includes bibliographical references (leaves 74-76).

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1. http://hdl.handle.net/1850/5202

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/60587436
Date	January 2004
Creators	Perry, Jeffrey L.
Source Sets	OCLC
Language	English
Detected Language	English
Source	Online version of thesis