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Spolehlivost pájených spojů LED panelů / Reliability of LED Panels Solder Joints

Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:319627
Date January 2017
CreatorsŠimon, Vojtěch
ContributorsŠpinka, Jiří, Starý, Jiří
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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