The connection between the devices of optical fiber system is an important part of optical communication equipment. For reducing the power loss in single transfer process, we couple the light from one device to another by connecting with splicer and connector.
In the optical fiber communication system, the fiber must be coupled with light source or detectors and optical amplifier. The way connect fiber by fusion splice is different from the mechanical connectors, which is small joint volume, higher mechanical strength and much stable after connecting. It is more suitable to apply on micro-package optical communication device. In the study, we confer with the temperature profile and thermal stress of fusion splice module during splicing Cr4+¡GYAG crystal fiber and single mode fiber by numerical simulations. Through adjusting the parameters, like fusion current, fusion place and the processes of splice to examine the trend of change of temperature and thermal stress.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0803106-125144 |
| Date | 03 August 2006 |
| Creators | Lu, Jhu-You |
| Contributors | none, none, none, none |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0803106-125144 |
| Rights | withheld, Copyright information available at source archive |
Page generated in 0.0017 seconds