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Processing of Thin Film Devices

The ability to do thin film processing has been established at UCF. This paper describes the facilities available. RF and DC sputtering was used for material deposition. The parameters for both were established experimentally, and the results are presented. Resistor and capacitor test patterns were used to test the accuracy of the system. The devices were fabricated and tested; experimental results are discussed.

Identiferoai:union.ndltd.org:ucf.edu/oai:stars.library.ucf.edu:rtd-5675
Date01 January 1984
CreatorsDelpak, Ramzi
PublisherSTARS
Source SetsUniversity of Central Florida
LanguageEnglish
Detected LanguageEnglish
Typetext
Formatapplication/pdf
SourceRetrospective Theses and Dissertations
RightsPublic Domain

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