The transient temperature of solid state power switches is investigated using thermal resistance network modelling and experimental testing. The ability of a heat sink mounted to the top of the device to reduce the transient temperature is assessed. Transient temperatures for heat pulses of up to 100ms are of most interest. The transient temperature distribution inside a typical stack-up of a solid state power switch is characterised. The thermal effects of adding a heat sink to the top of the device are then assessed. A variety of heat sink thicknesses and materials are evaluated. Components of the device stack-up are varied in order to assess their affect on the effectiveness of the heat sink in reducing the device temperature. Thermal networks are successfully applied to model the transient heat conduction inside the stack-ups. This modelling technique allowed a good understanding of the thermal behaviour inside the stack-up and heat sink during the transient period. The concept of using a heat sink to suppress the transient temperature was validated experimentally on two types of solid state power switch.
| Identifer | oai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:539206 |
| Date | January 2011 |
| Creators | Tighe, Christopher James Frederick |
| Publisher | University of Nottingham |
| Source Sets | Ethos UK |
| Detected Language | English |
| Type | Electronic Thesis or Dissertation |
| Source | http://eprints.nottingham.ac.uk/12714/ |
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