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Ekonomické způsoby pouzdření integrovaných obvodů a modulů / Economic encapsulation for integrated circuits and modules

This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper are basic information about packaging and aspects in design of package. Next parts are design of test samples, which are package to epoxide powder material. Based on the results of the tests method, it will propose, where the technology will be used.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:318862
Date January 2017
CreatorsKristek, Michal
ContributorsJankovský, Jaroslav, Szendiuch, Ivan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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