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Empirical characterization of a plated-through-hole interconnect for a multilayer stripline assembly at microwave frequencies

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1. http://hdl.handle.net/1853/15658
2. 344297

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/15658
Date	05 1900
Creators	Hopkins, Glenn Daniel
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.